Copper Gleam? HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company
2022-03-07 10:08
The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Key Benefits:
- High Throwing power at accelerate plating rate
- Bright uniform deposits
- Exceptional physical properties
- Complete analytical control
酸性鍍銅中間體相關鏈接：
垂直連續電鍍（VCP）高TP值酸性鍍銅光澤劑用電鍍中間體：www.xjren.com.cn/news/170.html
PCB/FPC用高TP值VCP酸性鍍銅光亮劑中間體產品介紹：www.xjren.com.cn/news/30.html
2021年度填孔鍍銅——印刷線路板（PCB，FPC）酸性填孔鍍銅中間體：www.xjren.com.cn/news/283.html
2021年國際表面處理展電子展廳：
深圳市同泰化學技術有限公司參加了2021年7月26-28日在廣州保利世貿博覽館舉辦的第十四屆廣州國際表面處理、電鍍、涂裝展覽會，誠邀您蒞臨同泰化學電子展廳參觀指導！電子展廳鏈接：www.xjren.com.cn/news/316.html。
微信掃一掃，關注我們